Session Details
[Session 3]Session 3: Two-Dimensional Materials
Mon. Sep 28, 2026 3:20 PM - 5:10 PM JST
Mon. Sep 28, 2026 6:20 AM - 8:10 AM UTC
Mon. Sep 28, 2026 6:20 AM - 8:10 AM UTC
Room A1(3rd floor)
[Session_3-01]Interface Modeling for TCAD Simulations of 2D Semiconductor Transistors
*Akiko Ueda1 (1. AIST)
[Session_3-02]Deterministic Full-Band Boltzmann Equation Solver for 2D Materials
*Hendrik Christoph Andre Leenders1, Josephine Faisst1, Christoph Jungemann1 (1. RWTH Aachen University)
[Session_3-03]Engineering of n-type Metal-TMD Contacts via Ferroelectric Polarization: an Ab-initio Transport Study
Alessandro Pilotto1, Daniel Lizzit1, *Marco Pala1, David Esseni1 (1. Univ. of Udine)
[Session_3-04]Full-Band Semi-Classical Monte Carlo Simulation of Layer Number-Dependent Hole Transport in W- and Mo-Based Transition Metal Dichalcogenides
*Donghyeok Lee1, Sukhyeong Youn1, Yoonhoo Ha2, Jiwon Chang1 (1. Yonsei Univ., 2. Samsung Adv. Inst. of Tech., Samsung Electronics Co., Ltd.)
[Session_3-05]Strain-Dependent Electron Transport in Mono-, Bi-, and Trilayer MoS2 and WS2 Using Coupled First-Principles and Full-Band Semi-Classical Monte-Carlo Simulation
*Seongwoo Kang1, Yoonhoo Ha2, Ilgu Yoon1, Jiwon Chang1 (1. Yonsei Univ., 2. Samsung Electronics Cop. Ltd.)
