Presentation Information
[6-13]Reliability Characterizations on the Hybrid Hot-Cold Data Conversion in 3D NAND Flash Memory under Various Temperatures
Yujiao Ding1, Ruidong Li2, Yining Zhou1, Xinghao Wang1, Peng Guo3, Yixuan Fan1, Pengpeng Sang1, Jixuan Wu1, *Xuepeng Zhan1, Jiezhi Chen1 (1. Shandong Univ. (China), 2. Cloud Computing Equipment Industry Innovation Co., Ltd (China), 3. Shandong Sinochip Semiconductors Co. Ltd, Jinan, China (China))
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