Presentation Information

[C-3_C-4-50]P-i-n type Mach-Zehnder modulators integrating InP-based multiple quantum well and Si waveguide by using chip-on-wafer bonding technology

〇Naotaka Kasuya1,2,3, Hajime Tanaka1,2,3, Kento Komatsu1,2,3, Taichi Misawa2, Naoko Inoue1,2,3, Takehiko Kikuchi1,2,3, Takuya Mitarai1,2,3, Shun Kimura1,2, Naoki Fujiwara1,2,3, Nobuhiko Nishiyama1,3, Hideki Yagi1,2,3 (1. Photonics Electronics Technology Research Association, 2. Transmission Devices Laboratory, Sumitomo Electric Industries, Ltd., 3. Dept. of Electrical and Electronic Engineering, Institute of Science Tokyo)

Keywords:

Mach-Zehnder modulator,InP/Si,Si photonics,chccip-on-wafer bonding