Presentation Information
[B-18-02]Software Defined Glue Logic for Battery-free Wireless Sensing
〇Tetsuma Ariyoshi1, Masashi Owaki1, Osamu Tokumasu1, Jin Mitsugi1 (1. Keio Univ.)
Keywords:
Wireless sensing,FPGA
This paper proposes a software defined glue logic for battery-free wireless sensing using 920 MHz backscatter communication. Conventional hardware based glue logic increases development costs and limits flexibility when interfacing RFICs with different sensors.The proposed method uses a Renesas ForgeFPGA operated with a low frequency external clock through the PLL-bypass function. This configuration enables operation within the 320 μW power available from the RFIC.Experimental results showed that the FPGA consumed less than 320 μW at operating frequencies of 500 kHz or lower. Communication performance was evaluated via SPI communication with an ADXL362 accelerometer at 20 kbps. Stable communication was achieved at operating frequencies of 320 kHz or higher, whereas lower frequencies resulted in increased error rates.These results demonstrate the feasibility of battery-free software defined glue logic operating at 320–500 kHz, providing a flexible and low-cost solution for interfacing a variety of sensors in backscatter-based wireless sensor systems.