Presentation Information
[C-3_C-4-03]Investigation of fabrication MEMS Wavelength-Control Devices toward Integration of Heterogeneous Materials and MEMS on SOI Substrates
◎Daiki Sakurai1, Yoshishige Tsuchiya2, Keita Nakamura1, Yoshitaka Oiso1, Kaibin Yao1, Haoyu Chen1, Eissa Moataz1, Tsuyoshi Horikawa1, Keisuke Kawahara1, Nobuhiko Nishiyama1,3 (1. ISCT, 2. University of Southampton , 3. Next-generation Semiconductor Eco-system Co-creation Center, Institute of Science Tokyo)
Keywords:
Integrated Optical Devices
In recent years, performance requirements for optical integrated circuits have been increasing in tandem with the widespread adoption of AI and IoT services. To date, we have proposed a process that integrates heterogeneous material integration technology with optical MEMS technology to enhance the functionality of optical integrated circuits. In this report, we examine a fabrication process for MEMS-type wavelength control devices on SOI substrates, incorporating self-aligned two-step etching and an etch-stop layer made of Al₂O₃, and present the results of demonstrations of the constituent processes.
