[IS] IS1.Frontiers in Structural Materials Research through Advanced Measurement Techniques

15:45 〜 16:15

[IS11] Enhancing Solder Joint Reliability through Mechanical Optimization of Intermetallic Compounds

○Jenn-Ming Song¹ (1. National Chung Hsing University)

キーワード：

Intermetallic compounds、Solder joint、Reliability、Plastic ability

This talk applies nanoindentation to clarify how crystal orientation, structure, and alloying modulate IMCs’mechanical performance, providing key insights for solder alloys and substrate designs aimed at enhancing interconnect durability.