Presentation Information

[[C]C302-3vn-07]Novel mechanism of strengthening adhesion bonding via acid-base interaction with a tiny amount of water: simulation from electron level

○Shuji Ogata1, Kunpei Kobori2, Takayuki Miyamae2, Shintaro Yamamoto3 (1. Nagoya Institute of Technology, 2. Chiba Univ., 3. Kobe Steel, Ltd.)

Keywords:

Adhesion,Acid-base interaction,Moisture,Protonation,Aluminum