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[BI-2-03]Key technologies of miniaturized 150GHz-band 3D multilayer module for 6G

○Yohei Morishita1, Ryosuke Hasaba1, Tomohiro Murata1, Koji Takinami1, Kei Murayama2, Kenichi Okada3, Shinsuke Hara4 (1. Panasonic Industry, 2. Shinko Electric Industries, 3. Tokyo Institute of Technology, 4. National Institute of Information and Communications Technology)
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Keywords:

6G,Wireless,mmW/THz,module,Antenna in Package