Presentation Information

[C-12-57]フリップチップ裏面電圧印加による集積回路特性変動の評価

◎△Shuhei Yokota1, Rikuu Hasegawa1, Takuya Wadatsumi1, Kazuki Monta1, Junichi Sakamoto2, Shinichi Kawamura2, Makoto Nagata1,2 (1. Kobe University, 2. Inst. of Advanced Industrial Science and Technology)

Keywords:

Flip Chip,Backside biasing,Emission Microscope