[O7-8] EMI Reduction and Reliability in Next-Generation Power Electronics | IPEC2026

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Session Details

Organized SessionSemiconductor Power Conversion

[O7-8]EMI Reduction and Reliability in Next-Generation Power Electronics

Tue. Jun 2, 2026 4:20 PM - 6:00 PM JST
Tue. Jun 2, 2026 7:20 AM - 9:00 AM UTC

Hall 1(2F)

Chair:Katsuya Nomura(Kwansei Gakuin University)

4:20 PM - 4:40 PM JST(7:20 AM - 7:40 AM UTC)

[O7-8-01]A study on smoothing and DC-link capacitor layout for EMI mitigation design of SiC power module

*Takaaki Ibuchi¹, Tsuyoshi Funaki¹ (1. Univ. of Osaka (Japan))

4:40 PM - 5:00 PM JST(7:40 AM - 8:00 AM UTC)

[O7-8-02]Noise Feedback Mechanisms Causing Turn-Off Switching Instability for Next-Generation Power Devices Packaged in Power Module

*Hiroto Sakai^1,2, Kotaro Kobashi¹, Masataka Ishihara², Kazuhiro Umetani³, Eiji Hiraki² (1. ROHM Co., Ltd. (Japan), 2. Okayama Univ. (Japan), 3. Kyushu Univ. (Japan))

5:00 PM - 5:20 PM JST(8:00 AM - 8:20 AM UTC)

[O7-8-03]Passive Cancellation for Reduction of Input and Output Side Common-Mode Noise in Three-Phase PWM Inverters

*Shotaro Takahashi¹, Yuta Miwa², Masashi Kato² (1. Nagoya Institute of Technology (Japan), 2. Akita University (Japan))

5:20 PM - 5:40 PM JST(8:20 AM - 8:40 AM UTC)

[O7-8-04]Active and Integrated Approaches for High-Density EM Noise Mitigation in Power Electronics Converters

*Fang Luo¹, Ali Anwar¹, Masayaki Hijikata¹, Yuxuan Wu¹ (1. Stony Brook University (USA))

5:40 PM - 6:00 PM JST(8:40 AM - 9:00 AM UTC)

[O7-8-05]Thermomechanical Stress Analysis of Planar Coils with Ceramics and FR4 Substrates

*Masaki Takahashi¹, Shaokang Luan¹, Zhongchao Sun¹, Ariya Sangwongwanich¹, Hongbo Zhao¹ (1. AAU Energy, Aalborg University (Denmark))

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