Session Details
[P2-3]Emerging technologies in Packaging, thermal management, system integration and reliability 2
Wed. Jun 3, 2026 12:40 PM - 2:00 PM JST
Wed. Jun 3, 2026 3:40 AM - 5:00 AM UTC
Wed. Jun 3, 2026 3:40 AM - 5:00 AM UTC
Poster3(Event & Exhibition Hall)
Chair:Takaya Sekiguchi(Hitachi, Ltd.)
[P2-3-01]Modular Accelerated Lifetime Testing Platform for Autonomous Testing of Multiple Proximal SiC MOSFETs to Inform Data-Driven RUL Estimation
Paul Bradford1, *Hongjie Wang1 (1. Utah State University (USA))
[P2-3-02]Condition Monitoring of Power Electronic Devices Using Modulation-Based Thermal Impedance Spectroscopy
Alireza Aghdaei1, *Rattapon Wayamanon2, Sven Kalker1, Lukas A. Ruppert1, Rik W. De Doncker1 (1. RWTH Univ. (Germany), 2. TGGS Univ. (Thailand))
[P2-3-03]Design of a Full Bridge Power Module for a Dual Active Bridge Converter
Weiping Fu1, Xiaoling Li1, Yuxiang Chen1, Liyang Du1, Saroj Majakoti1, *Alan Mantooth, David Huitink1, David Underwood2 (1. University of Arkansas (USA), 2. Micro Cooling Concepts, Inc (USA))
[P2-3-04]Improved Noise Source Modeling for BCM Single-Phase Grid-Connected Inverters With Zero Current Detection Delay
*Chen Liu1, Chao Chao Song1, Frede Blaabjerg1, Pooya Davari1 (1. Aalborg University (Denmark))
[P2-3-05]A Design Procedure for Current-Injection Active EMI Filter by Taking Load-Pulling Effect into Consideration
Jakrapong Wongsasulux2, *Surapong Suwankawin1, Thattam Narksook1, Achirawat Kaitkansiri1, Pawaret Ampai1 (1. Chulalongkorn University (Thailand), 2. Delta Electronics (Thailand) (Thailand))
[P2-3-06]Wireless Power Transmission Method using Superimposed PWM signal
*Atsushi YOSHIDA1, Kosuke MORIYA1, Hiyang SUNG1, Kyungmin SUNG1 (1. National Institute of Technology, Ibaraki College (Japan))
[P2-3-07]Impact of Core Segmentation on Eddy Current Loss in Mn-Zn Ferrite Cores at High Frequencies
*Naoya Miyata1, Itsuki Masuda1, Jun Imaoka2, Masayoshi Yamamoto2 (1. Department of Electrical Engineering, Nagoya University (Japan), 2. Institute of Materials and Systems for Sustainability (IMaSS), Nagoya University (Japan))
[P2-3-08]Electro-thermal Stability of Planar and Trench Gate SiC Power MOSFETs in Linear Mode Operation
*Yisi Liu1, Olayiwola Alatise2, Asad Mahmood2, Jose Ortiz Gonzalez2, Ian Laird1, Phil Meller1, Saeed Jahdi1 (1. University of Bristol (UK), 2. University of Warwick (UK))
[P2-3-09]Comparative Analysis of Flatwise and Edgewise Windings for Improved Thermal Management in Transformers
*Karl Raymond Dela Cruz Roque1, Itsuki Masuda1, Sihoon Choi2, Jun Imaoka1,2, Masayoshi Yamamoto1,2, Matti Kauhanen3, Kengo Tashiro4 (1. Department of Electrical Engineering, Nagoya University (Japan), 2. Institute of Materials and Systems for Sustainability (IMaSS), Nagoya University (Japan), 3. ABB Drives Oy (Finland), 4. HighQ Power Oy (Finland))
[P2-3-10]Geometrically Constrained Optimization of Planar Transformers for DCM Flyback Converters
*Tianming Luo1, Kamran Kamran1,2, Ziwei Ouyang1 (1. Technical University of Denmark (Denmark), 2. STMicroelectronics S.R.L. (Italy))
[P2-3-11]Parameter Estimation Techniques for DC-link Capacitors in Three-level NPC Inverters
*Diana Lopez-Caiza1, Ariya Sangwongwanich1, Mateja Novak1, Frede Blaabjerg1 (1. Aalborg University (Denmark))
[P2-3-12]Prediction and Mitigation of EMI from Near-Field Coupling Effects in Interleaved PFC Converters
Tyler McGrew1, *Che-An Cheng1, Qiang Li1 (1. Center for Power Electronic Systems, Virginia Tech (USA))
[P2-3-13]Reliability Evaluation of 650 V E-Mode GaN Devices Under HTRB and H3TRB Stress
*Mateja Novak1, Kaichen Zhang1, Senyu Du1, Arlene Rementeria1, Shuai Zhao1, Dao Zhou1, Francesco Iannuzzo2 (1. Aalborg University (Denmark), 2. Politecnico di Torino (Italy))
[P2-3-14]Link between Black Box and Physical EMC Models of Power Electronics Converters
Bayan Hamami2,1, Yandry Alexander Jacome Montero1, Genevieve Frantz1, *Jean-Luc SCHANEN1 (1. Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab (France), 2. Industrial Automation Schneider Electric Grenoble (France))