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[340] Investigation of Formation Mechanism of Three-Dimensional Structure Ni-Cu Alloy Plating

*Thai　Anh PHAM¹, Ikuo Shohji¹, Tatsuya Kobayashi¹ (1. Gunma Univ.)

Keywords:

Ni-Cu Alloy,Electroplating,Dealloying,Microstructure

本研究では, 電気化学測定器を用いて, 三次元構造Ni-Cu合金めっき膜の生成メカニズムを調査する.