Session Details

[G]Packaging (1)

Thu. Sep 22, 2022 9:00 AM - 11:15 AM JST
Thu. Sep 22, 2022 12:00 AM - 2:15 AM UTC
Rm. P C33,3Flr. Build.C
Chair:Equo KOBAYASHI(Tokyo Inst. of Tech.)
※表示の講演時間には質疑応答時間も含みます。
(質疑応答時間5分、基調講演と招待講演は5~10分)

[336]Interfacial Reaction between Pd-Cu-Ni Alloy and Sn-58Bi Solder

*kazumi watarai1, ikuo shohji1, Tatsuya Kobayashi1, Tomohisa Hoshino2, kenichi sato2, shunsuke kobayashi2, naohito odani2 (1. Graduate School of Science and Technology, Gunma Univ., 2. Yokowo Co., Ltd)

[337]Effect of Ag and Ni addition in Sn-58Bi eutectic alloy

*Yuki Tanaka1, Minho O2, Equo Kobayashi2 (1. Tokyo Institute of Technology(Master), 2. Tokyo Institute of Technology)

[338]Effect of MWCNT on the growth behavior of the compound at Sn-Ag-Cu solder joints

*Hiroka Iwamoto1, Minho O2, Equo Kobayashi2 (1. Tokyo Institute of Technology (Master), 2. Tokyo Institute of Technology)

[339]Effect of Addition of Sb on Ball Shear Strength of Joints with Sn-Ag-Cu Solder

*MARINA OYAMA1, Ikuo Shohji2, Tatsuya Kobayashi2, Mohd Arif Anuar Mohd Salleh3 (1. Gunma Univ, 2. Gunma Univ, 3. Universiti Malaysia Perlis)

break

[340]Investigation of Formation Mechanism of Three-Dimensional Structure Ni-Cu Alloy Plating

*Thai Anh PHAM1, Ikuo Shohji1, Tatsuya Kobayashi1 (1. Gunma Univ.)

[341]Galvanic Corrosion Behavior between Metal with Ni-Cu Alloy Plating Film and CFRTP

*Kei SHIMIZU1, Ikuo SHOHJI1, Tatsuya KOBAYASHI1 (1. Gunma University Graduate School of Science and Technology)

[342]Fabrication of High Temperature Solder by Zn-Al Particle Dispersion Electroplating

*Yuki ABIKO1, Ikuo SHOHJI1, Tatsuya KOBAYASHI1 (1. Graduate School of Science and Technology Gunma University)

[343]Fabrication and Evaluation of Lead-Free Solder by Tin-Cellulose Nanofibers Composite Plating

*Ayuki KOGURE1, Ikuo SHOHJI1, Tatsuya KOBAYASHI1 (1. Graduate School of Science and Technology, Gunma Univ.)