[G] Solid process/ Solid and welding process(2)

11:30 AM - 11:45 AM JST(2:30 AM - 2:45 AM UTC)

[132] Correlation between Fatigue Crack Network Damage and Thickness in Power Semiconductor Die Attach Joints

*Toshiyuki MISU¹, Yoshiharu KARIYA², Akihisa HUKUMOTO³, Masaki TAYA³ (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. Advanced Technology R&D Center, Mitsubishi Electric Corporation)

Keywords:

Power module,Die attach joint,Life prediction,Thermal fatigue crack network,Solder thickness

ダイアタッチであるはんだ合金に等2軸応力を負荷できるSi / Solder / Si接合体試験片を用いた高速温度サイクル試験を行い，はんだ厚さの違いによる疲労き裂ネットワーク形成の差異を調査した．