日本金属学会2023年秋期(第173回)講演大会
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Session Details

一般講演6.Materials Processing : Solid process/ Solid and welding process

[G]Solid process/ Solid and welding process(2)

Thu. Sep 21, 2023 10:00 AM - 12:30 PM JST
Thu. Sep 21, 2023 1:00 AM - 3:30 AM UTC
Rm. E 2nd Flr. Education and Research Building, School of Engineering
Chair:Naoyuki HAMADA
※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）
10:00 AM - 10:15 AM JST(1:00 AM - 1:15 AM UTC)

[127]The Effect of Internal Microstructure on Static Mechanical Properties of Ag Sintered Body by 3D Microscale Numerical Material Testings

*Tatsuki OTANI1, Yoshiharu KARIYA2, Koji SASAKI3 (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology, 3. NAMICS Corporation)
10:15 AM - 10:30 AM JST(1:15 AM - 1:30 AM UTC)

[128]Effect of Internal Structure on Fatigue Crack Propagation Rate of Sintered Ag particles

*Kazuya WASHIDA1, Yoshiharu KARIYA2, Koji SASAKI3 (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering Shibaura Institute of Technology, 3. NAMICS Corporation)
10:30 AM - 10:45 AM JST(1:30 AM - 1:45 AM UTC)

[129]Effect of Temperature on Fatigue Crack Propagation Rate at the Interface between Si Die and Underfill in Real Semiconductor Package Structures

*Takumi SHINADA1, Yoshiharu KARIYA2, Hiroshi YAMAGUCHI3, Toshiaki ENOMOTO3, Takuya YOSHIDA3 (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. NAMICS Corporation)
10:45 AM - 11:00 AM JST(1:45 AM - 2:00 AM UTC)

[130]Formation of Three-Dimensional Structure Ni-Cu Alloy Plating and Adhesion to Epoxy Resin

*THAI　ANH PHAM1, Ikuo Shohji1, Tatsuya Kobayashi1 (1. Gundai Rikou)
11:00 AM - 11:15 AM JST(2:00 AM - 2:15 AM UTC)

break

11:15 AM - 11:30 AM JST(2:15 AM - 2:30 AM UTC)

[131]Fracture Development Simulation of Die Attach Joint Subjected to Equiaxial Thermal Stress

*Saki FUNADERA1, Yoshiharu KARIYA2 (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology)
11:30 AM - 11:45 AM JST(2:30 AM - 2:45 AM UTC)

[132]Correlation between Fatigue Crack Network Damage and Thickness in Power Semiconductor Die Attach Joints

*Toshiyuki MISU1, Yoshiharu KARIYA2, Akihisa HUKUMOTO3, Masaki TAYA3 (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. Advanced Technology R&D Center, Mitsubishi Electric Corporation)
11:45 AM - 12:00 PM JST(2:45 AM - 3:00 AM UTC)

[133]Effect of Ag Addition on Fatigue Properties of Sn-Sb-Ag-Ni-Ge Solder Alloy

*Kentaro Kawai1, Tatsuya Kobayashi1, Ikuo Syohji1, Kohei Mitsui2, Hirohiko Watanabe1,2 (1. Graduate School of Science and Technology, Gunma Univ., 2. Fuji Electric Co., Ltd.)
12:00 PM - 12:15 PM JST(3:00 AM - 3:15 AM UTC)

[134]Investigation of Fatigue Properties of Sn-58Bi Lead-Free Solder for Flip Chip Bonding

*Shota UMEDA1, Tatsuya KOBAYASHI2, Ikuo SHOHJI2, Hirokazu NOMA3, Kazue HIRANO3, Hitoshi ONOZEKI3, Sadaaki KATOH3 (1. Graduate School of Science and Technology, Gunma Univ, 2. Graduate School of Science and Technology, Gunma Univ, 3. Resonac Corporation)
12:15 PM - 12:30 PM JST(3:15 AM - 3:30 AM UTC)

[135]Fracture Mechanics Evaluation of Delamination Strength of Interlayer Dielectric Film on Cu for Semiconductor Package Using Virtual Crack Model

*Hironao KAWABE1, Yoshiharu KARIYA2, Makoto HARAGUCHI3, Mitsuka ANDO3, Hirokazu ITO3 (1. Graduate School of Shibaura Institute of Technology, 2. Department of Materials Science and Engineering, Shibaura Institute of Technology, 3. JSR Corporation)
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