Presentation Information

11:45 AM - 12:00 PM JST(2:45 AM - 3:00 AM UTC)

[133]Effect of Ag Addition on Fatigue Properties of Sn-Sb-Ag-Ni-Ge Solder Alloy

*Kentaro Kawai¹, Tatsuya Kobayashi¹, Ikuo Syohji¹, Kohei Mitsui², Hirohiko Watanabe^1,2 (1. Graduate School of Science and Technology, Gunma Univ., 2. Fuji Electric Co., Ltd.)

Keywords:

Sn-Sb-Ag-Ni-Ge,Fatigue Properties,EBSD Analysis,Ag Addition,Solder Joint

Sn-Sb-Ag-Ni-Ge系はんだ合金中のAgが25℃と175℃での疲労特性に及ぼす影響を調べた。合金の疲労特性は175℃においても低下せず、Ag含有量の増加とともに向上した。

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