[G] Solid process/ Solid and welding process(1):Soldering(1)

2:50 PM - 3:05 PM JST(5:50 AM - 6:05 AM UTC)

[313] Evaluation of Delamination Strength of Interlayer Dielectric Film / Cu Interface for Semiconductor Package Redistribution Layer

*Colin YOSHIMOTO¹, Yoshiharu KARIYA², Mitsuka ANDO³, Tetsuya NEMOTO³, Hirokazu ITO³ (1. Graduate School of Shibaura Institute of Technology, 2. College of Engineering, Shibaura Institute of Technology, 3. JSR Corporation)

Keywords:

Critical energy release rate,Delamination,Dielectric film,Finite element method,Semiconductor package

シア試験およびT型剥離試験による剥離強度を簡易的な評価と，有限要素法による剥離解析を行い，疑似的に剥離靭性値を算出する方法を検討した．