Year 2025 Autumn Annual Meeting of JIMM
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Session Details

一般講演6.Materials Processing : Materials Processing

[G]Solid process/ Solid and welding process(1):Soldering(1)

Thu. Sep 18, 2025 2:50 PM - 5:30 PM JST
Thu. Sep 18, 2025 5:50 AM - 8:30 AM UTC
Room P(N302 3rd floor Building N)
座長:山内 啓(群馬工業高等専門学校)、小椋 智(大阪大学)
※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）
2:50 PM - 3:05 PM JST(5:50 AM - 6:05 AM UTC)

[313]Evaluation of Delamination Strength of Interlayer Dielectric Film / Cu Interface for Semiconductor Package Redistribution Layer

*Colin YOSHIMOTO1, Yoshiharu KARIYA2, Mitsuka ANDO3, Tetsuya NEMOTO3, Hirokazu ITO3 (1. Graduate School of Shibaura Institute of Technology, 2. College of Engineering, Shibaura Institute of Technology, 3. JSR Corporation)
Comment()
3:05 PM - 3:20 PM JST(6:05 AM - 6:20 AM UTC)

[314]Delamination Analysis of Dielectric Film / Redistribution Materials Interface in Large – Scale Semiconductor Packaging Structure

*Daisuke ANDO1, Yoshiharu KARIYA2 (1. Graduate School of Shibaura Institute of Technology, 2. College of Engineering, Shibaura Institute of Technology)
Comment()
3:20 PM - 3:35 PM JST(6:20 AM - 6:35 AM UTC)

[315]Evaluation of Fracture Mechanics Fatigue Crack Propagation Rate at the Interface Si Die and Underfill in Real Semiconductor Package Structures

*Akito AIZAWA1, Yoshiharu KARIYA2, Yuichi YANAKA3, Mitsuki NAKATA3 (1. Graduate School of Shibaura Institute of Technology, 2. College of Engineering, Shibaura Institute of Technology, 3. RESONAC Corporation)
Comment()
3:35 PM - 3:50 PM JST(6:35 AM - 6:50 AM UTC)

[316]Evaluation of Adhesion Reliability of Cu/Epoxy Resin Jouints by High Temperature Aging

*Anzu Tozaki1, Tatsuya Kobayashi1, Ikuo Shohji1, Hiroto Takenaka2, Hirose Suzuki2, Minoru Ueshima2 (1. Graduate School of Science and Technology, Gunma Univ., 2. DAICEL)
Comment()
3:50 PM - 4:05 PM JST(6:50 AM - 7:05 AM UTC)

[317]Evaluation of Mechanical Properties of Insulation Resin Sheets
for Power Module

*Keita Iwazaki1, Tatsuya Kobayashi1, Ikuo Shohji1, Yoshiaki Sakaniwa2, Eri Suganuma2, Miyu Shimura2, Touyou Ohashi2 (1. Graduate School of Science and Technology Gunma Univ, 2. Mitsubishi Materials Corporation)
Comment()
4:05 PM - 4:20 PM JST(7:05 AM - 7:20 AM UTC)

[318]Investigation of Mechanical Properties of Resin Materials for Flexible Printed Circuit Boards

*Hiroki Yonekura1, Tatsuya Kobayashi1, Ikuo Shohji1, Takanori Kawano2 (1. Graduate School of Science and Technology, Gunma Univ., 2. SANWA TECHNIC CORPORATION)
Comment()
4:20 PM - 4:30 PM JST(7:20 AM - 7:30 AM UTC)

break

4:30 PM - 4:45 PM JST(7:30 AM - 7:45 AM UTC)

[319]Influence of Bi Content on the Superplastic Deformation of Sn-Bi Based Alloys

*Akira YAMAUCHI1, Shiyu AKASHI1, Masashi KUROSE1 (1. National Institute of Technology, Gunma College)
Comment()
4:45 PM - 5:00 PM JST(7:45 AM - 8:00 AM UTC)

[320]Effect of Holding Time in Thermal Cycling Test on Thermal Fatigue Life of Lead-Free Solder Joints for Wafer-Level CSP

*Shun SAKAGAMI1, Kenta KAWAGUCHI1, Tatsuya KOBAYASHI1, Ikuo SHOHJI1, Fumiya FUNATOMI2, Kyohei OHASHI2, Ryuki SAKAI2 (1. Graduate School of Science and Technology, Gunma Univ., 2. ESPEC)
Comment()
5:00 PM - 5:15 PM JST(8:00 AM - 8:15 AM UTC)

[321]Effect of Microstructure Coarsening on Low Cycle Fatigue Life of Sn-Ag-Cu Solder Joints

*Ryoga TANABE1, Yoshiharu KARIYA2 (1. Graduate School of Shibaura Institute of Technology, 2. College of Engineering, Shibaura Institute of Technology)
Comment()
5:15 PM - 5:30 PM JST(8:15 AM - 8:30 AM UTC)

[322]Reproduction of Mixed Failure of Fatigue Crack Network and Horizontal Crack Propagation in Die Attach Joints by Damage Development Analysis

*Masaki MOCHIZUKI1, Yoshiharu KARIYA2, Ahmet Cetinkaya3 (1. Graduate School of Shibaura Institute of Technology, 2. College of Engineering, Shibaura Institute of Technology, 3. College of Engineering, Shibaura Institute of Technology)
Comment()
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