[G] Solid process/ Solid and welding process(1):Soldering(1) | Year 2025 Autumn Annual Meeting of JIMM

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Session Details

一般講演6.Materials Processing : Materials Processing

[G]Solid process/ Solid and welding process(1):Soldering(1)

Thu. Sep 18, 2025 2:50 PM - 5:30 PM JST
Thu. Sep 18, 2025 5:50 AM - 8:30 AM UTC

Room P(N302 3rd floor Building N)

座長:山内啓(群馬工業高等専門学校)、小椋智(大阪大学)

※表示の講演時間には質疑応答時間も含みます。
（質疑応答時間5分、基調講演と招待講演は5～10分）

2:50 PM - 3:05 PM JST(5:50 AM - 6:05 AM UTC)

[313]Evaluation of Delamination Strength of Interlayer Dielectric Film / Cu Interface for Semiconductor Package Redistribution Layer

*Colin YOSHIMOTO¹, Yoshiharu KARIYA², Mitsuka ANDO³, Tetsuya NEMOTO³, Hirokazu ITO³ (1. Graduate School of Shibaura Institute of Technology, 2. College of Engineering, Shibaura Institute of Technology, 3. JSR Corporation)

3:05 PM - 3:20 PM JST(6:05 AM - 6:20 AM UTC)

[314]Delamination Analysis of Dielectric Film / Redistribution Materials Interface in Large – Scale Semiconductor Packaging Structure

*Daisuke ANDO¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. College of Engineering, Shibaura Institute of Technology)

3:20 PM - 3:35 PM JST(6:20 AM - 6:35 AM UTC)

[315]Evaluation of Fracture Mechanics Fatigue Crack Propagation Rate at the Interface Si Die and Underfill in Real Semiconductor Package Structures

*Akito AIZAWA¹, Yoshiharu KARIYA², Yuichi YANAKA³, Mitsuki NAKATA³ (1. Graduate School of Shibaura Institute of Technology, 2. College of Engineering, Shibaura Institute of Technology, 3. RESONAC Corporation)

3:35 PM - 3:50 PM JST(6:35 AM - 6:50 AM UTC)

[316]Evaluation of Adhesion Reliability of Cu/Epoxy Resin Jouints by High Temperature Aging

*Anzu Tozaki¹, Tatsuya Kobayashi¹, Ikuo Shohji¹, Hiroto Takenaka², Hirose Suzuki², Minoru Ueshima² (1. Graduate School of Science and Technology, Gunma Univ., 2. DAICEL)

3:50 PM - 4:05 PM JST(6:50 AM - 7:05 AM UTC)

[317]Evaluation of Mechanical Properties of Insulation Resin Sheets
for Power Module

*Keita Iwazaki¹, Tatsuya Kobayashi¹, Ikuo Shohji¹, Yoshiaki Sakaniwa², Eri Suganuma², Miyu Shimura², Touyou Ohashi² (1. Graduate School of Science and Technology Gunma Univ, 2. Mitsubishi Materials Corporation)

4:05 PM - 4:20 PM JST(7:05 AM - 7:20 AM UTC)

[318]Investigation of Mechanical Properties of Resin Materials for Flexible Printed Circuit Boards

*Hiroki Yonekura¹, Tatsuya Kobayashi¹, Ikuo Shohji¹, Takanori Kawano² (1. Graduate School of Science and Technology, Gunma Univ., 2. SANWA TECHNIC CORPORATION)

4:20 PM - 4:30 PM JST(7:20 AM - 7:30 AM UTC)

break

4:30 PM - 4:45 PM JST(7:30 AM - 7:45 AM UTC)

[319]Influence of Bi Content on the Superplastic Deformation of Sn-Bi Based Alloys

*Akira YAMAUCHI¹, Shiyu AKASHI¹, Masashi KUROSE¹ (1. National Institute of Technology, Gunma College)

4:45 PM - 5:00 PM JST(7:45 AM - 8:00 AM UTC)

[320]Effect of Holding Time in Thermal Cycling Test on Thermal Fatigue Life of Lead-Free Solder Joints for Wafer-Level CSP

*Shun SAKAGAMI¹, Kenta KAWAGUCHI¹, Tatsuya KOBAYASHI¹, Ikuo SHOHJI¹, Fumiya FUNATOMI², Kyohei OHASHI², Ryuki SAKAI² (1. Graduate School of Science and Technology, Gunma Univ., 2. ESPEC)

5:00 PM - 5:15 PM JST(8:00 AM - 8:15 AM UTC)

[321]Effect of Microstructure Coarsening on Low Cycle Fatigue Life of Sn-Ag-Cu Solder Joints

*Ryoga TANABE¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. College of Engineering, Shibaura Institute of Technology)

5:15 PM - 5:30 PM JST(8:15 AM - 8:30 AM UTC)

[322]Reproduction of Mixed Failure of Fatigue Crack Network and Horizontal Crack Propagation in Die Attach Joints by Damage Development Analysis

*Masaki MOCHIZUKI¹, Yoshiharu KARIYA², Ahmet Cetinkaya³ (1. Graduate School of Shibaura Institute of Technology, 2. College of Engineering, Shibaura Institute of Technology, 3. College of Engineering, Shibaura Institute of Technology)

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