[G] Solid process/ Solid and welding process(1):Soldering(1)

3:20 PM - 3:35 PM JST(6:20 AM - 6:35 AM UTC)

[315] Evaluation of Fracture Mechanics Fatigue Crack Propagation Rate at the Interface Si Die and Underfill in Real Semiconductor Package Structures

*Akito AIZAWA¹, Yoshiharu KARIYA², Yuichi YANAKA³, Mitsuki NAKATA³ (1. Graduate School of Shibaura Institute of Technology, 2. College of Engineering, Shibaura Institute of Technology, 3. RESONAC Corporation)

Keywords:

the Interface Si Die and Underfill,Fatigue Crack Propagation Rate,Real Semiconductor Package Structures,response surface analysis,Box-Behnken Project

半導体パッケージのSiダイ / UF界面の疲労き裂進展速度を計測するため，統計的手法を用いて実験を容易にする最適形状を決定した結果，従来試験片に比べ，確実にき裂の発生・進展が可能であることが確認された．