[G] Solid process/ Solid and welding process(1):Soldering(1)

5:00 PM - 5:15 PM JST(8:00 AM - 8:15 AM UTC)

[321] Effect of Microstructure Coarsening on Low Cycle Fatigue Life of Sn-Ag-Cu Solder Joints

*Ryoga TANABE¹, Yoshiharu KARIYA² (1. Graduate School of Shibaura Institute of Technology, 2. College of Engineering, Shibaura Institute of Technology)

Keywords:

Low cycle fatigue,Solder joint,Sn-Ag-Cu,Reliability,Microstructure Coarsening

微小はんだ接合部の低サイクル疲労寿命におよぼす組織粗大化の影響を実験および解析から取得し，疲労寿命則に組織粗大化を組み込む方法を検討した．