[IS] IS2 Recent Trends and Future Perspectives of Semiconductor Materials

9:35 AM - 10:05 AM JST(12:35 AM - 1:05 AM UTC)

[IS2.2] Grain-engineered Co Alloys for Scaled Interconnects

*KIYOUNG LEE¹ (1. Department of Materials Science & Engineering, HONGIK UNIVERSITY, Seoul, Korea)

Keywords:

Scaled Interconnect,Resistivity Size Effect,Grain Boundary Scattering,Co Alloys,Thin Films

Ultrathin Co alloys show reduced resistivity scaling by improving electron transmission at grain boundaries through microstructural engineering.