[IS] IS2 Recent Trends and Future Perspectives of Semiconductor Materials

9:35 〜 10:05

[IS2.2] Grain-engineered Co Alloys for Scaled Interconnects

*KIYOUNG LEE¹ (1. Department of Materials Science & Engineering, HONGIK UNIVERSITY, Seoul, Korea)

キーワード：

Scaled Interconnect、Resistivity Size Effect、Grain Boundary Scattering、Co Alloys、Thin Films

Ultrathin Co alloys show reduced resistivity scaling by improving electron transmission at grain boundaries through microstructural engineering.