[G] Joining for Electrical and Electronic Materials(1)

3:15 PM - 3:30 PM JST(6:15 AM - 6:30 AM UTC)

[355] Effect of Pressure and Electrode Materials on Bond Strength of Sintered Ag Paste Joints

○Keita Iwazaki¹, Masato Okajima¹, Tatsuya Kobayash¹, Ikuo Shoji¹, Chuantong Chen² (1. Gunma Univ., 2. Osaka Univ.)

Keywords:

Sinter joining,SiC power device,Ag paste,Coefficient of thermal expansion,Thermal stress relaxation

Si-added Ag paste is expected to mitigate thermal stress in SiC devices due to its controllable CTE and suppressed grain coarsening. As a preliminary study, this report investigates the effects of sintering conditions (pressure/pressureless) and rivet surface conditions on bonding strength using conventional Ag paste.