Session Details

[G]Joining for Electrical and Electronic Materials(1)

Thu. Sep 24, 2026 1:00 PM - 5:30 PM JST
Thu. Sep 24, 2026 4:00 AM - 8:30 AM UTC
Room P(No.P403,4th Flr,Faculty of Integrated Science and Engineering for Environments Building No.2)
Chair:Minho O, Yusho Tatsumi, Shinji Fukumoto
※表示の講演時間には質疑応答時間も含みます。
(質疑応答時間5分、基調講演と招待講演は5~10分)

[347]Anodic Bonding of Tin to Glass

○MAKOTO Takahashi1 (1. Osaka Univ.)
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[348]Dissimilar joining via infiltrating resin into steel with a porous surface prepared by liquid metal dealloying

○Keiichi Suzuki1, Kota Kurabayashi1, Yutaka S. Sato1, Takeshi Wada1, Hidemi Kato1 (1. Tohoku Univ.)
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[349]Effect of Resin Thickness on Adhesion between Alicyclic Resin and Copper

○Yu Tonozuka1, Tatsuya Kobayashi1, Ikuo Shohji1 (1. Gunma Univ.)
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[350]Degradation Mechanism and Adhesion Strength of Al/Epoxy Resin Interfaces in High-Temperature and High-Humidity Environments

○Shin Hoshino1, Ikuo Shohji1, Tatsuya Kobayashi1, Fumiya Funatomi2, Kyohei Ohashi2, Ryuki Sakai2 (1. Graduate School of Science and Technology, Gunma Univ., 2. ESPEC)
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[351]Fabrication and Adhesion Strength Evaluation of Copper/Liquid Crystal Polymer Joints

○Taketo Sekiduka1, Ikuo Shohji1, Tatsuya Kobayashi1, Kunio Tada2, Minoru Ueshima2, Shinji Yamada2 (1. Gunma Univ., 2. DAICEL)
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[352]Study on Fracture Mechanics Evaluation Methods for Resin Delamination in Resin-Encapsulated Power Semiconductor Modules

○Ryota Yamazaki1, Yoshiharu Kariya2, Yusuke Kaji3 (1. Graduate School of Shibaura Inst. of Technol., 2. College of Engineering, Shibaura Inst. of Technol., 3. Mitsubishi Electric)
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[353]紫外線硬化接着剤の硬化応力計算用粘弾性構成式における
シフトファクターの硬化度依存性

○kazuma izawa1, Takumi Oguri1, Yoshiharu Kariya2, Kouji Yamamoto3 (1. Graduate School of Shibaura Institute of Technology, 2. College of Engineering, Shibaura Institute of Technology, 3. Cybernet Systems Co.,Ltd.)
Comment()

[354]Location Dependence of Fatigue Crack Propagation Rate at the Si Die/Underfill Interface in Semiconductor Package Structures

○Akito Aizawa1, Yoshiharu Kariya2, Yuichi Yanaka3, Mitsuki Nakata3 (1. Graduate School of Shibaura Institute of Technology, 2. College of Engineering, Shibaura Institute of Technology, 3. Resonac Corporation)
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[355]Effect of Pressure and Electrode Materials on Bond Strength of Sintered Ag Paste Joints

○Keita Iwazaki1, Masato Okajima1, Tatsuya Kobayash1, Ikuo Shoji1, Chuantong Chen2 (1. Gunma Univ., 2. Osaka Univ.)
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[356]Damage-Evolving FEM Analysis of the Effect of Internal Porous Structure on the Fatigue Crack Propagation Rate in Sintered Ag Particles

○Shiori Tajima1, Yoshiharu Kariya2, Koji Sasaki3 (1. Graduate School of Shibaura Inst. of Technol., 2. College of Engineering, Shibaura Inst. of Technol., 3. NAMICS)
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[357]Fatigue Properties of Sintered Ag Nanoparticle Bodies Derived from Fatigue Crack Network Formation Under Biaxial Thermal Stress

○Ryosuke Yamada1, Yoshiharu Kariya2, Takuya Tomura3 (1. Graduate School of Shibaura Inst. of Technol., 2. College of Engineering Shibaura Inst. of Technol., 3. Bando Chemical)
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[358]Numerical Material Testing of Nonlinear Mechanical Behavior of
Sintered Ag Particles Using 3D-Microscale FE Model

○Yuma Okuhira1, Yoshiharu Kariya2, koji Sasaki3 (1. Graduate School of Shibaura Inst. of Technol., 2. Shibaura Inst. of Technol., 3. NAMICS)
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[359]Recovery of Ag sintered joints via current-assisted microstructural control

○Takugo Naganuma1, Tomoki Matuda1, Shinji Fukumoto1 (1. The University of Osaka)
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[360]Optimization of Surface Treatment Conditions for Improving the Melting and Bonding Properties of Zn-Coated Al Particles Bonding Material

○Tomoya Iwazaki1, Ikuo Shohji1, Shinji Koyama1, Tatsuya Kobayashi1 (1. Graduate School of Science and Technology, Gunma Univ.)
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[361]Effect of Bonding Conditions and Aging on Shear Strength of Sintered Joints with Low Melting Point Sn Microparticle Paste

○Kokone Koike1, Tatsuya Kobayashi1, Ikuo Shohji1, Ko Fukushima2, Masayuki Sasaki2 (1. Graduate School of Science and Technology, Gunma Univ., 2. SAKATA INX)
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[362]Brazing of Stainless Steel using Ni Brazing Filler Metal with Added Fe-Al Alloy Powder

○Yuta Irie1, Tatsuya Kobayashi1, Ikuo Shohji1, Junichiro Hirohashi2, Katsufumi Inoue2, Tsunehito Wake2, Hiroki Yamamoto3 (1. Graduate School of Science and Technology, Gunma Univ., 2. Waki Factory Inc., 3. KANDORI Industry Ltd.)
Comment()