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[360] Optimization of Surface Treatment Conditions for Improving the Melting and Bonding Properties of Zn-Coated Al Particles Bonding Material

○Tomoya Iwazaki¹, Ikuo Shohji¹, Shinji Koyama¹, Tatsuya Kobayashi¹ (1. Graduate School of Science and Technology, Gunma Univ.)

Keywords:

lead-free solder,Zn–Al system,electroless zinc plating,zincate treatment,formic acid

We focused on Zn-Al-based solder alloys as lead-free bonding materials for power semiconductor packaging. In this study, we applied electroless Zn plating to Al particles, which are prone to oxidation. Furthermore, we fabricated particulate bonding materials with surface protection provided by a metal salt coating on the particle surfaces.