[19p-D902-1~14] 12.3 Functional Materials and Novel Devices

3:30 PM - 3:45 PM JST(6:30 AM - 6:45 AM UTC)

[19p-D902-7] Direct conductive bonding of silver interconnections on ultra-thin polymer thin films using water vapor plasma assisted bonding.

〇(M2)Tatsuma Miyake^1,2, Masahito Takakuwa^2,3, Kenjiro Fukuda², Shinjiro Umezu¹, Takao Someya^2,3 (1.Waseda Univ., 2.RIKEN, 3.Univ. of Tokyo)

Keywords:

Flexible conductive bonding,Silver,Flexible electronics

In flexible and stretchable electronics, stress concentration at junctions between devices is an issue. We have succeeded in conductive bonding of silver electrodes on thin films in air without loss of flexibility by surface-activated bonding using water vapor plasma. In this study, we investigated the relationship between the state in the chamber and bonding/non-bonding in water vapor plasma and confirmed that bonding occurs when the ratio of generated OH and O radicals is less than about 30%.