[20a-C401-1~12] 1.3 Novel technologies and interdisciplinary engineering

12:15 PM - 12:30 PM JST(3:15 AM - 3:30 AM UTC)

[20a-C401-12] Precise Thinning for Semiconductor Laser Diodes by Fusion Welding of Uniform Deposited Metal

〇Yuuki Tsuji¹, Taegyu Woo¹, Syouhei Lin¹, Yudai Isahaya¹, Chishu Mori¹, Taro Itatani², Joji Maeda¹, Takeru Amano² (1.Tokyo Univ. Science, 2.AIST)

Keywords:

semiconductor laser,metal deposiotion,fusion welding

Co-Packaged Optics (CPO) technology, in which electronic and optical components are highly integrated, is being promoted for high-capacity and power saving communications. We have reported the thinning of semiconductor lasers to the 40 µm level using CMP, but yield and reproducibility have been issues. In this report, we describe the thinning of semiconductor lasers using fusion welding of deposited metals, which has excellent uniformity of film thickness.