[20p-A201-1~16] 3.14 Silicon photonics and integrated photonics (formerly 3.15)

3:15 PM - 3:30 PM JST(6:15 AM - 6:30 AM UTC)

[20p-A201-7] Development of next-generation co-packaged optics with 3D optical wiring

〇Satoshi Suda¹, Takayuki Kurosu¹, Akihiro Noriki¹, Fumi Nakamura¹, Taro Itatani¹, Takeru Amano¹ (1.AIST)

Keywords:

co-packaged optics,polymer waveguide,silicon photonics

We have been developing a co-packaged optics using three-dimensional optical interconnection, in which a silicon optical waveguide and a polymer optical waveguide are coupled by a three-dimensional mirror. The three-dimensional optical wiring uses dissimilar materials, silicon and polymer, which have thermal expansion coefficients two orders of magnitude different, and there are concerns about the effects of high-temperature operation. In this study, we successfully demonstrated 56 Gb/s PAM4 broadband optical transmission of 16 wavelength channels on a prototype chip at 85°C, demonstrating the usefulness of the co-packaged optics.