Presentation Information
[21a-P03-13]Crack prevention by SiO layer for the BPF on resin substrate
〇Koichi Muro1, Akira Mochiduki2, Wataru Kanazawa3 (1.Teikyo Univ., 2.Taishou Optical., 3.Sanwa Kenma, Ltd.)
Keywords:
Silicon monoxide,Optical Thin-film,Crack prevention
Resins are increasingly being used as base materials for windows and lenses in place of glass. Optical thin films that control the light spectrum are composed of metal oxides. When forming an optical thin film on a resin substrate, there is a problem that cracks and peeling occur during heating because the linear expansion coefficient differs by two orders of magnitude. Therefore, by using silicon monoxide (SiO), which is a suboxide, as a buffer layer, the heat resistance (crack prevention) of the band-pass filter film formed on the resin substrate was improved.