[21p-B204-1~19] 11.4 Analog applications and their related technologies

3:00 PM - 3:15 PM JST(6:00 AM - 6:15 AM UTC)

[21p-B204-6] Nb-pad direct bonding for 3D integration of superconducting devices

〇(M2)Atsushi Kudo^1,2, Masahisa Fujino², Hiroshi Nakagawa², Yuki Araga², Katsuya Kikuchi², Toru Taino¹ (1.Saitama Univ., 2.AIST)

Keywords:

Superconductivity,3D integration,Room-temperature bonding

Currently, for the practical application of superconducting devices, research is being conducted on 3D integration, in which devices and wiring are integrated on separate substrates and the substrates are bonded to each other. We have focused on surface-activated bonding as a bonding method, and have directly bonded pads, which are vertical interconnections, using Nb as a material. In this study, we fabricated a daisy-chain device by bonding pads with a height of approximately 2 µm. After bonding, the devices were placed in a 4K refrigerator to measure the superconducting transition temperature and current-voltage characteristics at cryogenic temperature.