[22a-A304-1~10] 6.4 Thin films and New materials

9:30 AM - 9:45 AM JST(12:30 AM - 12:45 AM UTC)

[22a-A304-3] Copper coating by reduction firing process using EDTA metal complex as raw material

〇Kyouichi a Shibata¹, Ken Ishida¹, Reo Kimura¹, Atsushi Nakamura^1,2, Keiji Komatsu¹, Hidetoshi Saitoh¹ (1.Nagaoka Univ. Tech., 2.Chubu Chelest Co., Ltd.)

Keywords:

EDTA metal complex,reduction firing process,Copper coating