[22a-P03-1~32] 12.3 Functional Materials and Novel Devices

[22a-P03-6] Dismantling from Adhesion Interface Induced by Thermo/Photocleavable Molecular Layer

〇Miho Aizawa^1,2, Haruhisa Akiyama³, Yoko Matsuzawa³, Atsushi Shishido¹ (1.Lab. for Chem. & Life Sci., Tokyo Tech, 2.PRESTO, JST, 3.AIST)

Keywords:

adhesion,molecular layer,stimuli-responsive

Dismantlable adhesion systems are becoming increasingly important in industrial applications due to the demand for recycling of a range of materials. Many dismantlable adhesives that reduce the adhesive force have been developed by utilizing stimuli for inducing bulk state changes. In this study, we demonstrated a novel dismantling system based on switching the covalent bonding at the adhesion interface by employing a thermo-and photocleavable molecular layer, which contrast to other dismantlable adhesives. We fabricated the cleavable molecular layer consisted with anthracene dimers at the adhesion interface and investigated the effect of the chemical bond changes on the adhesion strength.