[22p-B205-1~19] 12.1 Fabrications and Structure Controls

3:30 PM - 3:45 PM JST(6:30 AM - 6:45 AM UTC)

[22p-B205-8] Formation of Plated Wiring on Three-Dimensional Resin Moldings by Molecular Bonding Technology

〇Kazuyuki Meguro¹, Emi Kurosu¹, Yoshiyuki Yamazaki¹, Kazunori Suzuki¹ (1.Iwate Industrial Research Inst.)

Keywords:

molecular bonding technology,molded interconnect device,electroless plating

3D-Molded Interconnect Devices (3D-MID) are attracting attention for the purpose of saving space in electronic devices. In order to realize 3D-MID that supports high-speed communication, we need technology to form plated wiring without roughening the resin surface. We achieved a resin-plating interface roughness Ra 0.13 μm and plated wiring on a 45° slope by maskless direct patterning technology that forms plated wiring on a smooth resin material surface using the developed molecular bonding technology.