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[16p-A22-7]Fabrication and electrical properties of GaN vertical junction barrier Schottky diode using N/Mg ion-implantation

〇Woong Kwon1, Yuta Itoh1, Atsushi Tanaka2, Hirotaka Watanabe2, Yoshio Honda2,3,4, Hiroshi Amano2,3,4 (1.Nagoya Univ., 2.IMaSS Nagoya Univ., 3.Dcenter Nagoya Univ., 4.IAR Nagoya Univ.)
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Keywords:

Vertical GaN power device,Junction barrier Schottky diode,Selective doping technique

In this study, vertical GaN junction barrier Schottky diodes (JBSDs) were fabricated using N/Mg ion implantation. From I-V characteristics, increased the barrier height and decreased the reverse leakage current were confirmed by narrowing the width of the Schottky region in the JBSDs. Ion(1.2 V)/Ioff(-650 V) was 109, indicating that a high on/off was achieved over a wide voltage range. The on-resistance was 1.2-1.4 mΩcm2.

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