[16p-A41-1~9] (Open Symposium) The Frontline of Materials, Processes, and Packaging Technologies Collaborating with State-of-the-Art Logic Semiconductors

2:35 PM - 3:05 PM JST(5:35 AM - 6:05 AM UTC)

[16p-A41-4] A New Beginning for Back-End Processes: The Future of Innovative Chiplet Technology

〇Yasumitsu Orii¹ (1.Rapidus Corporation)

Keywords:

Chiplet,Semiconductor Packaging

The advancements in semiconductor manufacturing and packaging technologiesare revolutionizing the semiconductor industry. Splitting a SoC chip into individualchips by function brings improved yields, shorter design, development cycles, andcost reduction. However, packaging structures are becoming more complex, leadingto increased design complexity. To overcome these challenges, the entire industryshould promote the integration of front-end and then back-end processes andestablish a chiplet ecosystem.