[16p-A41-1~9] (Open Symposium) The Frontline of Materials, Processes, and Packaging Technologies Collaborating with State-of-the-Art Logic Semiconductors

4:25 PM - 4:55 PM JST(7:25 AM - 7:55 AM UTC)

[16p-A41-7] Development of Package Substrate with Organic Interposer linked to Advanced Logic Device

〇Shota Miki¹ (1.SHINKO ELECTRIC INDUSTRIES CO., LTD.)

Keywords:

Organic interposer,Semiconductor package,Chiplet

As the digital society progresses, package structure using HBM and chiplet have become important in semiconductor packaging. In addition, packaging technology that integrates multiple die on a single substrate is attracting attention. This paper reports on the development of semiconductor package substrate using organic interposer, which is advantageous for substrate enlargement and support heterogeneous and chiplet integration.