[16p-A41-1~9] (Open Symposium) The Frontline of Materials, Processes, and Packaging Technologies Collaborating with State-of-the-Art Logic Semiconductors

4:55 PM - 5:25 PM JST(7:55 AM - 8:25 AM UTC)

[16p-A41-8] Automotive Chiplet Technologies Cooperating with Advanced AI

〇Takao Iwaki¹ (1.MIRISE)

Keywords:

chiplet,AI,SoC

In advanced driver assistance systems and autonomous driving, sophisticated AI technologies are employed for several functions such as object recognition, self-localization and trajectory planning. Since the required AI performance varies by types of vehicles, many different SoCs (System on a Chip) are needed in order to cover a wide range from a few TOPS to over 1,000 TOPS for a generation. Developing all of these separately is not realistic, and thus chiplet technology, where multiple chips are combined in the manner of LEGO blocks, is gaining attention. The challenges and solutions related to chiplet technology for automotive applications will be discussed.