Presentation Information
[16p-B1-13]Effects of unifying temperature over a substrate during Freeze Cleaning Method
〇Satoshi Nakamura1, Kensuke Demura1, Masashi Yamage1, Kei Hattori2 (1.Shibaura Mechatronics Corp., 2.Nagoya Univ. Center for Low-Temperature Plasma Sciences)
Keywords:
semiconductor,photomask,cleaning
As semiconductor devices continue to shrink in size, the size of minimum particle required to be removed from EUV masks have become smaller and smaller. In the Freeze Cleaning method developed by Shibaura is innovative cleaning technology that can remove minute particles without impacting the pattern.
In this study, we evaluated the effect of substrate in-plane temperature distribution on PRE (particle removal efficiency) during thawing and found that PRE improves with a smaller in-plane temperature difference. Uniform substrate temperature distribution enables a reduction in the number of freezing cycles and shortens the processing time.
In this study, we evaluated the effect of substrate in-plane temperature distribution on PRE (particle removal efficiency) during thawing and found that PRE improves with a smaller in-plane temperature difference. Uniform substrate temperature distribution enables a reduction in the number of freezing cycles and shortens the processing time.
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