Presentation Information

[17p-B2-4]Modification of Residual Vacancies in RTP Wafers

〇Haruo Sudo1, Hiroya Iwashiro1,2, Ken Hayakawa1 (1.GWJ, 2.Okayama Pref. Univ.)
PDF DownloadDownload PDF

Keywords:

dangling bond,vacancy,RTP

The modification of residual vacancies in RTP wafers is of yet unclear. Using ESR, we investigated the Si dangling bond density in the RTP wafers with a high concentration vacancy.

Comment

To browse or post comments, you must log in.Log in