Presentation Information
[17p-C41-10]Application of surface activated bonding to photonic devices
〇Eiji Higurashi1 (1.Tohoku Univ.)
Keywords:
Surface activated bonding,Low temperature bonding
In recent years, bonding technology has attracted much attention and has become increasingly important to realize high-performance multifunctional photonic devices that feature small size, low power consumption, high thermal dissipation, and high output power and so on. In particular, the room-temperature or low-temperature bonding technology with advanced features such as low thermal damage and low residual stress is today becoming a key technology for heterogeneous integration. In this lecture, I will focuses on the room-temperature or low-temperature bonding technology and introduces recent research topics in photonic devices.
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