[17p-C41-1~11] Plasma direct bonding technology for next-generation semiconductor and new device manufacturing

5:25 PM - 5:55 PM JST(8:25 AM - 8:55 AM UTC)

[17p-C41-10] Application of surface activated bonding to photonic devices

〇Eiji Higurashi¹ (1.Tohoku Univ.)

Keywords:

Surface activated bonding,Low temperature bonding

In recent years, bonding technology has attracted much attention and has become increasingly important to realize high-performance multifunctional photonic devices that feature small size, low power consumption, high thermal dissipation, and high output power and so on. In particular, the room-temperature or low-temperature bonding technology with advanced features such as low thermal damage and low residual stress is today becoming a key technology for heterogeneous integration. In this lecture, I will focuses on the room-temperature or low-temperature bonding technology and introduces recent research topics in photonic devices.