Presentation Information

[17p-C41-11]Panel discussion

〇Atsushi Tanide1,2, Hiromasa Tanaka2, Kenji Ishikawa2, Kenji Takahashi3, Tadatomo Suga4, Masahito Takakuwa4, Seiichi Hata5, Kosuke Takenaka6, Jianbo Liang7, Eiji Higurashi8 (1.SCREEN HD, 2.Nagoya Univ. cLPS, 3.AIST, 4.Tokyo Univ., 5.Nagoya Univ., 6.Osaka Univ., 7.Osaka Metropolitan Univ., 8.Tohoku Univ.)

Keywords:

plasma,bonding,semiconductor


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