[17p-C41-1~11] Plasma direct bonding technology for next-generation semiconductor and new device manufacturing

2:35 PM - 2:50 PM JST(5:35 AM - 5:50 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[17p-C41-4] Interfacial Characterization of Novel Bonding Dielectric Films for 3D Integration

〇Hayato Kitagawa¹, Ryosuke Sato¹, Fumihiro Inoue¹ (1.YOKOHAMA National Univ.)

Keywords:

Hybrid Bonding,3D Integration,Chiplet Integration