[17p-D62-1~9] 7.3 Micro/Nano patterning and fabrication

3:30 PM - 3:45 PM JST(6:30 AM - 6:45 AM UTC)Presentation by Applicant for JSAP Young Scientists Presentation Award

[17p-D62-8] Hybrid soft replica mold for fine Ag wiring without a residual layer

〇Yuri Nakamura¹, Jun Taniguchi¹ (1.Tokyo Univ. of Sci.)

Keywords:

Fine wiring,Residual layer-free,Hybrid soft replica mold

As electronic devices become more functional, there is a demand for finer metal interconnects. Normally, the formation of fine wiring of 10 µm or less requires a vacuum environment and large machinery of evaporation and etching equipment, which increases production time and cost. In this study, we developed a new UV-NIL process using a photosensitive conductive paste that can be formed in air to produce fine wiring patterns of 5 µm or less. A replica mold with a light-shielding layer on the convex part was used to fabricate independent patterns. This method is useful for improving the efficiency of fine wiring.