[22p-71A-1~8] 【Open Symposium】A la carte Packaging Technologies: Challenges and Future Prospects of Advanced Semiconductor Packaging Technologies

3:45 PM - 4:15 PM JST(6:45 AM - 7:15 AM UTC)

[22p-71A-5] Thermal Design and Control on Microprocessors and Power Electronics

〇Koji Nishi¹ (1.Ashikaga Univ.)

Keywords:

microprocessor,power electronics,thermal design

Microprocessors are the brains of computers which support modern society, and their performance is improving. Also, power electronics technology highly advances in recent years. In this presentation, thermal design and control of microprocessors are explained briefly and thermal problems and solutions of microprocessors and power semiconductors are discussed. In addition, the thermal impedance distribution, which can be utilized as a method for transient temperature prediction and heat transfer path visualization, is introduced.