[22p-71A-1~8] 【Open Symposium】A la carte Packaging Technologies: Challenges and Future Prospects of Advanced Semiconductor Packaging Technologies | The 71st JSAP Spring Meeting 2024

Session Details

Symposium (Oral)Symposium : 【Open Symposium】A la carte Packaging Technologies: Challenges and Future Prospects of Advanced Semiconductor Packaging Technologies

[22p-71A-1~8]【Open Symposium】A la carte Packaging Technologies: Challenges and Future Prospects of Advanced Semiconductor Packaging Technologies

Fri. Mar 22, 2024 1:30 PM - 5:30 PM JST
Fri. Mar 22, 2024 4:30 AM - 8:30 AM UTC

71A (Building No. 7)

Keizo Kinoshita(AIO Core), Noriaki Matsunaga(Applied Materials Japan)

Symposium Sponsor

1:30 PM - 1:45 PM JST(4:30 AM - 4:45 AM UTC)

[22p-71A-1]Opening Remarks

〇Jiro Ida^1,2 (1.Kanazawa Inst. of Tech., 2.Chief Secretary of Silicon Technology Division)

1:45 PM - 2:15 PM JST(4:45 AM - 5:15 AM UTC)

[22p-71A-2]Semiconductor Packaging Technology toward 2 nm Era

〇Toshihisa Nonaka¹ (1.Rapidus Corporation)

2:15 PM - 2:45 PM JST(5:15 AM - 5:45 AM UTC)

[22p-71A-3]Packaging Technologies for Miniaturized Si Photonics Transceiver Chips

〇Koichi Takemura¹ (1.AIO Core)

2:45 PM - 3:15 PM JST(5:45 AM - 6:15 AM UTC)

[22p-71A-4]Enhancement and Evolution of Direct Imaging Technology for Advanced Semiconductor Packaging

〇Hideki Yajima¹, Yoshinori Kobayashi¹ (1.ORC Manufacturing)

3:45 PM - 4:15 PM JST(6:45 AM - 7:15 AM UTC)

[22p-71A-5]Thermal Design and Control on Microprocessors and Power Electronics

〇Koji Nishi¹ (1.Ashikaga Univ.)

4:15 PM - 4:45 PM JST(7:15 AM - 7:45 AM UTC)

[22p-71A-6]Design Strategy of Power Semiconductor Devices Packaging Techniques for Next Generation Electric Vehicle

〇Masayoshi Yamamoto¹ (1.Nagoya Univ.)

4:45 PM - 5:15 PM JST(7:45 AM - 8:15 AM UTC)

[22p-71A-7]Present and future perspectives of 3D stacking technologies for CMOS image sensors

〇Hayato Iwamoto¹ (1.Sony Semiconductor Solutions Corporation)

5:15 PM - 5:30 PM JST(8:15 AM - 8:30 AM UTC)

[22p-71A-8]Closing Remarks

〇Osamu Nakatsuka^1,3, Katsura Miyashita^2,3 (1.Nagoya Univ., 2.Toshiba Electronic Devices & Storage Corporation, 3.Vice Secretary of Silicon Technology Division)

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