Presentation Information

9:45 AM - 10:00 AM JST(12:45 AM - 1:00 AM UTC)

[23a-12K-4]Electroless Ni-P Plating of the 3D Printed Matters from the Liquid Resin Containing Organometallic Catalysta

〇(M1)Shinsuke Takahata¹, Po-wei Cheng¹, Chun-Yi Chen¹, Tomoyuki Kurioka¹, Masato Sone¹, Tso-fu Mark Chang¹ (1.Tokyo tech)

Keywords:

Electroless Ni-P Plating,flexible electronics

In recent years, there has been a growing demand for electrical conductivity imparting technology to 3D printed materials capable of forming various structures. Our laboratory has reported that supercritical carbon dioxide (sc-CO2) can form high-quality electroless plating films. However, since the sc-CO2 apparatus contains special features and complicated processes, it is necessary to develop a simpler method. Therefore, in this study, we investigated electroless plating on 3D printed materials made of liquid resin containing organic catalyst.

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