[23a-71A-1~2] 8.7 Plasma Electronics Invited Talk

9:30 AM - 10:15 AM JST(12:30 AM - 1:15 AM UTC)

[23a-71A-1] [INVITED] Challenges in Scalable Manufacturing Technology for Highly-Stacking 3D Flash Memory

〇Hideshi Miyajima¹ (1.Kioxia Corporation)

Keywords:

semiconductor,3D NAND flash memory

The pursuit of high stacking technology in 3D NAND Flash Memory has significant manufacturing challenges, including cost, yield, and sustainability. The purpose of this presentation is to focus the discussion on the complexity of high stacking technology, its impact on cost, difficulties in improving yield, and challenges for future technologies. Cost-effective manufacturing, yield improvement, and sustainable manufacturing are needed to overcome these challenges and ensure a sustainable and robust memory technology ecosystem.