[24a-P04-1~6] 3.6 Laser processing (formerly 3.7)

[24a-P04-1] Piercing and cutting of polyimide film by He-free short-pulse CO₂ laser

〇Ryo Okawa¹, Kazuyuki Uno¹, Shohei Watarai², Yasushi Kodama^1,2 (1.Yamanashi Univ., 2.Seidensha Electronics)

Keywords:

CO2 laser,Polyimide,Laser processing

We investigated piercing and cutting of polyimide films depending on the fluence per pulse using our developed high-repetition-rate and high-power-capable He-free short-pulse CO₂ laser. Samples of polyimide films with thicknesses of 50 μm, 100 μm, 150 μm, and 200 μm were utilized. The fluence per pulse was adjusted to 19.4 J/cm², 10.3 J/cm², and 4.89 J/cm² for the short pulse with tail at a repetition rate of 200 Hz, and piercing and cutting were conducted.