Presentation Information
[24a-P07-4]Development of fabrication processes for packaging thinned CMOS image sensors
〇Shigeyuki Imura1, Masahide Goto1, Hiroto Sato1 (1.NHK STRL)
Keywords:
curved CMOS image sensor,FDSOI,Flexible substrate
Aiming at acquiring wide-field-of-view images with minimal distortion, we have been studying curved CMOS image sensors. In this research, a thin CMOS image sensor is made flexible by transferring it to a flexible substrate, which is then curved to capture images. This allows optical aberrations caused by the lens to be corrected and also facilitates miniaturization of the camera by reducing the number of lenses. In this study, we report on the development of a fabrication processes that is resistant to ultrasonic vibration and wire processing during wire bonding by thinning only the pixel area of the image sensor, leaving the input/output pad thicker.