The 71st JSAP Spring Meeting 2024
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Session Details

Symposium (Oral)Symposium : 【Open Symposium】Challenge to the Future - Vision of Future Society Pioneered by Cutting-Edge Semiconductors

[23a-61B-1~12]【Open Symposium】Challenge to the Future - Vision of Future Society Pioneered by Cutting-Edge Semiconductors

Sat. Mar 23, 2024 9:15 AM - 11:45 AM JST
Sat. Mar 23, 2024 12:15 AM - 2:45 AM UTC
61B (Building No. 6)
Emi Tamechika(Yokohama Natl. Univ.)
9:15 AM - 9:20 AM JST(12:15 AM - 12:20 AM UTC)

[23a-61B-1]Introduction

〇Keizo KINOSHITA1,2 (1.JSAP, 2.AIO Core)
9:20 AM - 10:10 AM JST(12:20 AM - 1:10 AM UTC)

[23a-61B-2]Into the Dream ~What are you looking for?~

〇Kazunari Ishimaru1 (1.Rapidus Corporation)
10:10 AM - 10:20 AM JST(1:10 AM - 1:20 AM UTC)

[23a-61B-3]Challenge to the fastest patent proposal

〇Yasuhiro Nakahara1 (1.KIOXIA)
10:20 AM - 10:30 AM JST(1:20 AM - 1:30 AM UTC)

[23a-61B-4]Age and position do not matter! The first step towards technological innovation

〇Tsukasa Hirao
10:30 AM - 10:40 AM JST(1:30 AM - 1:40 AM UTC)

[23a-61B-5]Co-creating the future with overseas customer: Tackle challenges without being afraid of failure!

〇Tetsuro Kadowaki1 (1.Hitachi High-Tech Corporation)
10:40 AM - 10:50 AM JST(1:40 AM - 1:50 AM UTC)

[23a-61B-6]Nikon's challenges and future vision in the semiconductor equipment business (exposure, metrology and inspection)

〇Tasuku Kato1 (1.Nikon Corporation)
10:50 AM - 11:00 AM JST(1:50 AM - 2:00 AM UTC)

[23a-61B-7]Challenge to the development and implementation of advanced wafer measurement technology

〇Nakamori Takaya1 (1.Canon)
11:00 AM - 11:10 AM JST(2:00 AM - 2:10 AM UTC)

[23a-61B-8]Work for a measurement instrument manufacturer: Evolving "measurement technology" with data science

〇Asuka Hirai1 (1.HORIBA, Ltd.)
11:10 AM - 11:20 AM JST(2:10 AM - 2:20 AM UTC)

[23a-61B-9]Experience in Applied Materials Japan at the leading edge of semiconductor technology and beyond

〇Asahi Sawasato1 (1.Applied Materials)
11:20 AM - 11:30 AM JST(2:20 AM - 2:30 AM UTC)

[23a-61B-10]Future outlook from the perspective of bonder equipment manufacturers

〇HIDETOMO UMEDA1 (1.Toray Engineering)
11:30 AM - 11:40 AM JST(2:30 AM - 2:40 AM UTC)

[23a-61B-11]Small Display, Big Possibilities: The Challenge of Creating the Future Visual Experience

〇KOICHI AMARI1 (1.Sony Semiconductor Solutions)
11:40 AM - 11:45 AM JST(2:40 AM - 2:45 AM UTC)

[23a-61B-12]Closing Remarks

〇Kiyoshi Watanabe1 (1.SEAJ)
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